Calculation of technological parameters of deposition process of carbon films on copper buffer layer

Authors

  • B. Z. Мansurov Казахский национальный университет им. аль-Фараби
  • B. S. Мedyanova
  • M. E. Mansurova
  • B. A. Аliyev
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Keywords:

carbon films, buffer layer, sputtering coefficient, sputtering rate, evaporation rate.

Abstract

In work calculations results of analytical dependences of technological parameters of deposition process of carbon films on copper buffer layer are presented, which allow to predict optimal concentration of hydrogen in a gas mix, intervals of working tension target-anode, thickness of deposited films and respectively time of experiments.

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Published

2013-09-27

Issue

Section

Condensed Matter Physics and Materials Science Problems. NanoScience