A study of the effects of wet chemical treatment on the surface of monocrystalline silicon wafers

Authors

  • N.A. Chuchvaga Kazakh National Technical University after K.I. Satpayev, Institute of Physics and Technology, Kazakhstan, Almaty
  • N.M. Kislyakova Kazakh National Technical University after K.I. Satpayev, Institute of Physics and Technology, Kazakhstan, Almaty
  • K.P. Aimaganbetov Kazakh National Technical University after K.I. Satpayev, Institute of Physics and Technology, Kazakhstan, Almaty
  • B.A. Rakymetov Kazakh National Technical University after K.I. Satpayev, Institute of Physics and Technology, Kazakhstan, Almaty
  • N.S. Tokmoldin Kazakh National Technical University after K.I. Satpayev, Institute of Physics and Technology, Kazakhstan, Almaty
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Keywords:

photovoltaics, amorphous silicon, solar cell, passivation

Abstract

In the course of the work, experiments on wet chemical treatment of single-crystal silicon wafers were carried out. Samples of monocrystalline silicon wafers after various stages of wet chemical treatment were obtained and the lifetimes of non-basic carriers in these samples were measured. In addition, we studied the effect of each step of dry cleaning on the properties of single-crystal silicon wafers, experiments were conducted to study the effect of various recipes for wet dry cleaning of silicon wafers on the lifetime of non-basic charge carriers and the reflection coefficient of light from the surface of the samples. A few recipes of the method of wet chemical processing was selected. Namely, the concentration of the etching solution and the etching time were changed in this technique, and then the samples were measured.The results of studies have shown that the increase in the lifetime of non-basic charge carriers in the plates begins with the etching stage of the disturbed layer, while the degreasing itself has no effect on the lifetime of non-basic charge carriers. Also, it was shown that an important role is played by the purification of the surface from metals and the final treatment in hydrofluoric acid. It was found that to achieve better etching results it is much more effective to increase the time of plate treatment in solution than the concentration of alkali.

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How to Cite

Chuchvaga, N., Kislyakova, N., Aimaganbetov, K., Rakymetov, B., & Tokmoldin, N. (2018). A study of the effects of wet chemical treatment on the surface of monocrystalline silicon wafers. Recent Contributions to Physics (Rec.Contr.Phys.), 67(4), 108–114. Retrieved from https://bph.kaznu.kz/index.php/zhuzhu/article/view/929

Issue

Section

Condensed Matter Physics and Materials Science Problems. NanoScience

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